- Patent Title: Carrier, laminate and method of manufacturing semiconductor devices
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Application No.: US16550151Application Date: 2019-08-23
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Publication No.: US11576259B2Publication Date: 2023-02-07
- Inventor: Hans-Joachim Schulze , Andre Brockmeier , Tobias Franz Wolfgang Hoechbauer , Gerhard Metzger-Brueckl , Matteo Piccin , Francisco Javier Santos Rodriguez
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H05K1/03 ; H01L21/683 ; H01L29/16
Abstract:
A carrier configured to be attached to a semiconductor substrate via a first surface comprises a continuous carbon structure defining a first surface of the carrier, and a reinforcing material constituting at least 2 vol-% of the carrier.
Public/Granted literature
- US20200068709A1 CARRIER, LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES Public/Granted day:2020-02-27
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