Invention Grant
- Patent Title: Method and apparatus for terminating an electrical cable to an integrated circuit
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Application No.: US17378949Application Date: 2021-07-19
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Publication No.: US11576260B2Publication Date: 2023-02-07
- Inventor: James Dunlop
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: BakerHostetler
- Main IPC: H01R12/53
- IPC: H01R12/53 ; H05K1/11 ; H05K1/02
Abstract:
An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.
Public/Granted literature
- US20210345486A1 METHOD AND APPARATUS FOR TERMINATING AN ELECTRICAL CABLE TO AN INTEGRATED CIRCUIT Public/Granted day:2021-11-04
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