Invention Grant
- Patent Title: Cold plate attachment with stabilizing arm
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Application No.: US17358156Application Date: 2021-06-25
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Publication No.: US11576282B2Publication Date: 2023-02-07
- Inventor: Juha Tapani Paavola
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K7/14

Abstract:
Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, a heat source located on the printed circuit board, a cold plate over the heat source, and a pair of cold plate attachments with stabilizing arms. Each of the pair of cold plate attachments with stabilizing arms include a printed circuit board attachment portion secured to the printed circuit board using only a single through hole, a load portion that extends from the printed circuit board attachment portion towards the cold plate, a cold plate attachment portion that secures the cold plate attachment with stabilizing arm to the cold plate, and a stabilizing portion that extends from the cold plate attachment portion to the printed circuit board.
Public/Granted literature
- US20210321541A1 COLD PLATE ATTACHMENT WITH STABILIZING ARM Public/Granted day:2021-10-14
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