Invention Grant
- Patent Title: Molded panels
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Application No.: US16495472Application Date: 2017-05-01
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Publication No.: US11577456B2Publication Date: 2023-02-14
- Inventor: Chien-Hua Chen , Michael W Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2017/030374 WO 20170501
- International Announcement: WO2018/203872 WO 20181108
- Main IPC: B29C64/209
- IPC: B29C64/209 ; B33Y30/00 ; B29D99/00 ; B41J2/14 ; B41J2/16

Abstract:
Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.
Public/Granted literature
- US20200094475A1 MOLDED PANELS Public/Granted day:2020-03-26
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