Invention Grant
- Patent Title: Methods and apparatus for depositing materials on a continuous substrate
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Application No.: US16306171Application Date: 2017-06-02
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Publication No.: US11578004B2Publication Date: 2023-02-14
- Inventor: David Masayuki Ishikawa , Brian H. Burrows
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- International Application: PCT/US2017/035728 WO 20170602
- International Announcement: WO2017/210583 WO 20171207
- Main IPC: C23C16/34
- IPC: C23C16/34 ; C04B35/628 ; C04B35/80 ; C23C16/04 ; C23C16/54 ; B65H51/00

Abstract:
Methods and apparatus for depositing material on a continuous substrate are provided herein. In some embodiments, an apparatus for processing a continuous substrate includes: a first chamber having a first volume; a second chamber having a second volume fluidly coupled to the first volume; and a plurality of process chambers, each having a process volume defining a processing path between the first chamber and the second chamber, wherein the process volume of each process chamber is fluidly coupled to each other, to the first volume, and to the second volume, and wherein the first chamber, the second chamber, and the plurality of process chambers are configured to process a continuous substrate that extends from the first chamber, through the plurality of process chambers, and to the second chamber.
Public/Granted literature
- US20200290932A1 METHODS AND APPARATUS FOR DEPOSITING MATERIALS ON A CONTINUOUS SUBSTRATE Public/Granted day:2020-09-17
Information query
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