Invention Grant
- Patent Title: Substrate bonding apparatus
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Application No.: US16842083Application Date: 2020-04-07
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Publication No.: US11581188B2Publication Date: 2023-02-14
- Inventor: Junhyung Kim , Kyeongbin Lim , Minsoo Han , Minwoo Rhee , Inbae Chang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0122155 20191002
- Main IPC: H01L21/18
- IPC: H01L21/18 ; B32B37/00 ; B23K20/10 ; H01L21/20 ; H01L21/683 ; H01L21/687 ; H01L21/67 ; H05K13/08 ; B32B41/00 ; B32B37/10 ; B32B38/18
Abstract:
A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.
Public/Granted literature
- US20210104405A1 SUBSTRATE BONDING APPARATUS Public/Granted day:2021-04-08
Information query
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