Invention Grant
- Patent Title: Electrostatic chuck having a cooling structure
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Application No.: US17063302Application Date: 2020-10-05
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Publication No.: US11581211B2Publication Date: 2023-02-14
- Inventor: Jeonghun Hwang , Hankyun Yoo
- Applicant: MICO CERAMICS LTD.
- Applicant Address: KR Anseong
- Assignee: MICO CERAMICS LTD.
- Current Assignee: MICO CERAMICS LTD.
- Current Assignee Address: KR Anseong
- Priority: KR10-2019-0144080 20191112
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67

Abstract:
Disclosed is an electrostatic chuck with a cooling structure using a cooling gas. The electrostatic chuck comprises: an electrostatic chuck plate that includes a plurality of first cooling gas holes formed in a first region and a plurality of second cooling gas holes formed in a second region; and a base member that includes a first flow path pattern connected to the plurality of first cooling gas holes, a second flow path pattern connected to the plurality of second cooling gas holes, and an inlet moving pattern changing a position of an inlet of a cooling gas injected into the first flow path pattern.
Public/Granted literature
- US20210143043A1 ELECTROSTATIC CHUCK Public/Granted day:2021-05-13
Information query
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