Invention Grant
- Patent Title: Integrated circuit structure
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Application No.: US17384888Application Date: 2021-07-26
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Publication No.: US11581227B2Publication Date: 2023-02-14
- Inventor: Kuei-Ming Chang , Rei-Jay Hsieh , Cheng-Han Wu , Chie-Iuan Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/08 ; H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L21/8234

Abstract:
An IC structure includes a semiconductor fin, first and second gate structures, and an isolation structure. The semiconductor fin extends from a substrate. The first gate structure extends above a top surface of the semiconductor fin by a first gate height. The second gate structure is over the semiconductor fin. The isolation structure is between the first and second gate structures, and has a lower dielectric portion embedded in the semiconductor fin and an upper dielectric portion extending above the top surface of the semiconductor fin by a height that is the same as the first gate height. When viewed in a cross section taken along a longitudinal direction of the semiconductor fin, the upper dielectric portion of the isolation structure has a rectangular profile with a width greater than a bottom width of the lower dielectric portion of the isolation structure.
Public/Granted literature
- US20210351086A1 INTEGRATED CIRCUIT STRUCTURE Public/Granted day:2021-11-11
Information query
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