Invention Grant
- Patent Title: CPU cooling system with direct spray cooling
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Application No.: US16099049Application Date: 2017-05-11
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Publication No.: US11581243B2Publication Date: 2023-02-14
- Inventor: Michael Hinton , Laurent Mydlarski
- Applicant: HYPERTECHNOLOGIE CIARA INC.
- Applicant Address: CA Saint-Laurent
- Assignee: HYPERTECHNOLOGIE CIARA INC.
- Current Assignee: HYPERTECHNOLOGIE CIARA INC.
- Current Assignee Address: CA Saint-Laurent
- Agency: Benoit & Cote Inc.
- Agent Charles-Andre Caron
- International Application: PCT/CA2017/050568 WO 20170511
- International Announcement: WO2017/193216 WO 20171116
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/40 ; H05K7/20 ; G06F1/20

Abstract:
There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.
Information query
IPC分类: