Invention Grant
- Patent Title: Integrated circuit containing a decoy structure
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Application No.: US17014058Application Date: 2020-09-08
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Publication No.: US11581270B2Publication Date: 2023-02-14
- Inventor: Julien Delalleau , Christian Rivero
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1756939 20170721
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00 ; H01L23/528 ; H01L29/06 ; H01L27/088 ; H01L29/10 ; H01L27/02 ; H01L29/08 ; H01L21/8234 ; H01L21/3205 ; H01L21/3213 ; H01L29/49 ; H01L29/45
Abstract:
An integrated circuit includes a substrate, an interconnection part, and an isolating region located between the substrate and the interconnection part. A decoy structure is located within the isolating region and includes a silicided sector which is electrically isolated from the substrate.
Information query
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