Invention Grant
- Patent Title: Electronic circuit
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Application No.: US16869840Application Date: 2020-05-08
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Publication No.: US11581303B2Publication Date: 2023-02-14
- Inventor: Louise De Conti , Philippe Galy
- Applicant: STMicroelectronics SA
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Crowe & Dunlevy
- Priority: FR1904838 20190509
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/12 ; H01L29/74

Abstract:
An electronic circuit includes a first electronic component formed above a buried insulating layer of a substrate and a second electronic component formed under the buried insulating layer. The insulating layer is thoroughly crossed by a semiconductor well. The semiconductor well electrically couples a terminal of the first electronic component to a terminal of the second electronic component.
Information query
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