Invention Grant
- Patent Title: Solid-state image sensor and electronic device
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Application No.: US16874442Application Date: 2020-05-14
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Publication No.: US11581346B2Publication Date: 2023-02-14
- Inventor: Shinji Miyazawa , Yutaka Ooka
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2012-203069 20120914
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
Public/Granted literature
- US20200279883A1 SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE Public/Granted day:2020-09-03
Information query
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