Invention Grant
- Patent Title: Manufacturing method of semiconductor device
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Application No.: US17254426Application Date: 2019-06-19
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Publication No.: US11581427B2Publication Date: 2023-02-14
- Inventor: Junichi Koezuka , Masami Jintyou , Takahiro Iguchi , Yasutaka Nakazawa
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JPJP2018-123991 20180629
- International Application: PCT/IB2019/055127 WO 20190619
- International Announcement: WO2020/003055 WO 20200102
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L21/383 ; H01L21/4757 ; H01L29/786 ; G02F1/1368 ; H01L21/465 ; H01L27/12 ; H01L27/32 ; H01L29/423

Abstract:
A semiconductor device with favorable electrical characteristics is provided. A semiconductor device with stable electrical characteristics is provided. A highly reliable semiconductor device is provided. A semiconductor layer is formed, a gate insulating layer is formed over the semiconductor layer, a metal oxide layer is formed over the gate insulating layer, and a gate electrode which overlaps with part of the semiconductor layer is formed over the metal oxide layer. Then, a first element is supplied through the metal oxide layer and the gate insulating layer to a region of the semiconductor layer that does not overlap with the gate electrode. Examples of the first element include phosphorus, boron, magnesium, aluminum, and silicon. The metal oxide layer may be processed after the first element is supplied to the semiconductor layer.
Public/Granted literature
- US20210126115A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2021-04-29
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