- Patent Title: Thermoelectric conversion material chip manufacturing method, and method for manufacturing thermoelectric conversion module using chip obtained by said manufacturing method
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Application No.: US17271021Application Date: 2019-08-27
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Publication No.: US11581469B2Publication Date: 2023-02-14
- Inventor: Kunihisa Kato , Tsuyoshi Muto , Masaya Todaka , Yuma Katsuta
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Itabashi-ku
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Itabashi-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2018-159259 20180828
- International Application: PCT/JP2019/033405 WO 20190827
- International Announcement: WO2020/045376 WO 20200305
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/08 ; H01L35/32
Abstract:
A method for producing a chip of a thermoelectric conversion material formed of a thermoelectric semiconductor composition, including a step of forming a sacrificial layer on a substrate, (B) a step of forming a thermoelectric conversion material layer of a thermoelectric semiconductor composition on the sacrificial layer, (C) a step of annealing the thermoelectric conversion material layer, (D) a step of transferring the annealed thermoelectric conversion material layer to a pressure-sensitive adhesive layer, (E) a step of individualizing the thermoelectric conversion material layer into individual chips of a thermoelectric conversion material, and (F) a step of peeling the individualized chips of a thermoelectric conversion material; and a method for producing a thermoelectric conversion module using the chip produced according to the production method.
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