Invention Grant
- Patent Title: Communication apparatus for supporting envelope tracking modulation and envelope delay optimization method
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Application No.: US17185498Application Date: 2021-02-25
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Publication No.: US11581964B2Publication Date: 2023-02-14
- Inventor: Hongmin Choi , Haedong Yeon , Junse Lee , Heesang Noh , Changhyun Baek
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2020-0083606 20200707
- Main IPC: H04B17/364
- IPC: H04B17/364 ; H04B17/354 ; H04B17/13

Abstract:
A method is provided. The method includes estimating adjacent channel leakage ratios respectively corresponding based on a test output signal output from a power amplifier according to a test input signal corresponding to a plurality of frequencies; selecting a test delay value corresponding to a largest value among the estimated adjacent channel leakage ratios; and providing a supply voltage to the power amplifier based on an envelope signal delayed according to the selected test delay value. For each of the plurality of test delay values, a corresponding adjacent channel leakage ratio is estimated based on a ratio of a magnitude of a component included in the test output signal and a magnitude of an inter-modulated component.
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