Invention Grant
- Patent Title: Component mounting system
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Application No.: US17259742Application Date: 2018-07-19
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Publication No.: US11582891B2Publication Date: 2023-02-14
- Inventor: Hidetoshi Kawai
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2018/027069 WO 20180719
- International Announcement: WO2020/016987 WO 20200123
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/02

Abstract:
A component mounting system that includes a component mounter in which multiple component supply units are detachably arranged in a supply area and mounts components on a board based on a job. The system performs a preparatory arrangement control for dividing the component supply units required for the job into multiple, and controlling the unit exchange device to make an arrangement of the component supply units in each group match an arrangement order in the supply area, and a supply arrangement control for controlling the unit exchange device to automatically exchange the component supply units, and to arrange the component supply units required for the job after switching in the supply area.
Public/Granted literature
- US20210289679A1 COMPONENT MOUNTING SYSTEM Public/Granted day:2021-09-16
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