Invention Grant
- Patent Title: Packaging for dental implant components
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Application No.: US16802207Application Date: 2020-02-26
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Publication No.: US11583370B2Publication Date: 2023-02-21
- Inventor: Alexander Chelminski , Dan P Rogers , Elizabeth A Schlueter , Miguel Montero
- Applicant: BIOMET 3I, LLC
- Applicant Address: US FL Palm Beach Gardens
- Assignee: BIOMET 3I, LLC
- Current Assignee: BIOMET 3I, LLC
- Current Assignee Address: US FL Palm Beach Gardens
- Agency: Sheridan Ross P.C.
- Main IPC: A61C8/00
- IPC: A61C8/00

Abstract:
Packaging systems for dental implants and methods for implanting a packaged implant are provided herein. The packaging system includes a housing and a cap forming an enclosure for a dental implant and corresponding healing screw. The housing includes a first and second base portion that interact with a platform that receives a portion of the dental implant to present the dental implant to a user during use.
Public/Granted literature
- US20200275999A1 PACKAGING FOR DENTAL IMPLANT COMPONENTS Public/Granted day:2020-09-03
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