Invention Grant
- Patent Title: Heart pump cuff
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Application No.: US17140286Application Date: 2021-01-04
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Publication No.: US11583671B2Publication Date: 2023-02-21
- Inventor: John Duc Nguyen , Huy Ngo , Carine Hoarau , Fabian Franco
- Applicant: TC1 LLC
- Applicant Address: US MN St. Paul
- Assignee: TC1 LLC
- Current Assignee: TC1 LLC
- Current Assignee Address: US MN St. Paul
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: A61M60/859
- IPC: A61M60/859 ; A61M60/148 ; A61M60/178 ; A61M60/183 ; A61M60/863 ; A61M60/232 ; A61M60/473

Abstract:
At least some embodiments of the disclosure may advantageously limit bleeding and the occurrence of blood leaks after heart pump implantation. In some embodiments, a base may be provided that includes a flexible layer mechanically coupled with a conduit. The flexible layer may be coupled with the proximal end of the conduit. The conduit may be configured to receive a cannula of the heart pump therethrough. The outer surface of the conduit may be configured to engage a surface of the heart formed after coring the heart. The conduit may be metal and may have a flared and/or beveled distal end. The conduit may be a flexible material. A distal flexible layer may be provided at a distal end of the conduit that is configured to engage with an inner surface of the heart.
Public/Granted literature
- US20210121677A1 Heart Pump Cuff Public/Granted day:2021-04-29
Information query
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