Invention Grant
- Patent Title: Poly-supported copper foil
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Application No.: US17868874Application Date: 2022-07-20
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Publication No.: US11584109B2Publication Date: 2023-02-21
- Inventor: Kieran Healy
- Applicant: Advanced Copper Foil Inc.
- Applicant Address: CA Mississauga
- Assignee: Advanced Copper Foil Inc.
- Current Assignee: Advanced Copper Foil Inc.
- Current Assignee Address: CA Mississauga
- Agency: Rowand LLP
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B32B15/08 ; B32B37/12 ; H05K1/18 ; B32B7/025 ; B32B7/12 ; B32B38/16 ; B32B38/00
Abstract:
A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.
Public/Granted literature
- US20220347972A1 POLY-SUPPORTED COPPER FOIL Public/Granted day:2022-11-03
Information query
