Invention Grant
- Patent Title: Assembly station for interconnecting a chassis and a body
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Application No.: US17062675Application Date: 2020-10-05
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Publication No.: US11584465B2Publication Date: 2023-02-21
- Inventor: Robert J. Eickholt
- Applicant: Mahindra N.A. Tech Center
- Applicant Address: US MI Auburn Hills
- Assignee: Mahindra N.A. Tech Center
- Current Assignee: Mahindra N.A. Tech Center
- Current Assignee Address: US MI Auburn Hills
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: B62D65/18
- IPC: B62D65/18 ; B62D65/02 ; B65G47/61

Abstract:
An assembly station for interconnecting a chassis and a body of a vehicle comprises a first carrier to support the chassis. A second carrier is suspended in a positive z-direction with respect to the first carrier and includes a plurality of spaced apart rests adapted to support the body prior to interconnecting the chassis and the body. A plurality of supports are coupled to the second carrier and spaced apart from the body when the body is supported on the rests. A portion of each of the supports is pivotable from a first position in a path of travel of the chassis to a second position outside of the path of travel of the chassis. The first carrier is moveable relative to the second carrier. The supports are adapted to engage the chassis and simultaneously support both the chassis and the body when the supports are in the first position.
Public/Granted literature
- US20210016849A1 Assembly Station For Interconnecting A Chassis And A Body Public/Granted day:2021-01-21
Information query
IPC分类: