Invention Grant
- Patent Title: Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system
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Application No.: US17547117Application Date: 2021-12-09
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Publication No.: US11585764B1Publication Date: 2023-02-21
- Inventor: Dermot Cantwell , Quentin Ernie Walker , Serghei Malkov , Jatinder Kumar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: G01R27/04
- IPC: G01R27/04 ; G01R27/32 ; G01N22/00 ; G01N22/04 ; G01N22/02 ; G01R27/06 ; G01R27/28

Abstract:
Methods and systems for multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system are provided. A radio frequency (RF) signal is pulsed within a processing chamber in accordance with a set of RF pulsing parameters. Sensor data is received from one or more sensors that indicates a multi-level RF pulse waveform detected within the processing chamber based on the RF signal pulsing. One or more peaks are identified in the detected multi-level RF pulse waveform. Each identified peak corresponds to at least one RF signal pulse of the RF signal pulsing within the processing chamber. A determination is made, based on the identified one or more peaks, whether the detected multi-level RF pulse waveform corresponds to the target multi-level RF pulse waveform. An indication of whether the detected multi-level RF pulse waveform corresponds to the target multi-level RF pulse waveform is provided to a client device.
Public/Granted literature
- US1376469A Railway-car-roof structure Public/Granted day:1921-05-03
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