Invention Grant
- Patent Title: Package structure
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Application No.: US17315376Application Date: 2021-05-10
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Publication No.: US11585992B2Publication Date: 2023-02-21
- Inventor: Chia-Lun Chang , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hsuan-Ting Kuo , Chia-Shen Cheng , Chih-Chiang Tsao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01L23/538 ; H01L25/18 ; H01L23/31 ; H01L23/00 ; H01L25/00 ; H01L21/683 ; H01L21/56 ; G02B6/43 ; H05K1/18 ; H05K1/02
Abstract:
In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.
Public/Granted literature
- US20210263243A1 PACKAGE STRUCTURE Public/Granted day:2021-08-26
Information query
