Invention Grant
- Patent Title: Distributed input/output (IO) control and interlock ring architecture
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Application No.: US17192318Application Date: 2021-03-04
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Publication No.: US11586573B2Publication Date: 2023-02-21
- Inventor: James Robert Reed , Kiyki-Shiy N. Shang , Martin A. Jolivet
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F13/40
- IPC: G06F13/40 ; H01L21/67 ; G05B19/05 ; H04L12/40

Abstract:
A system includes a programmable logic control (PLC) module, an input/output (IO) network bus coupled to the PLC module and provided at facets of a mainframe. A first process chamber attached to a first facet of the facets. A chamber interface IO sub-module is attached to the first facet and coupled to the IO network bus and to a process chamber IO controller of the first process chamber. The chamber interface IO sub-module is to: convert interlock relay signals, received via dry contact exchange with the process chamber IO controller, to digital signals; combine the digital signals into network packets adapted for communication using a protocol of the IO network bus; and transmit the network packets to the PLC module over the IO network bus.
Public/Granted literature
- US20210191895A1 DISTRIBUTED INPUT/OUTPUT (IO) CONTROL AND INTERLOCK RING ARCHITECTURE Public/Granted day:2021-06-24
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