Invention Grant
- Patent Title: Method and apparatus for detecting defect pattern on wafer based on unsupervised learning
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Application No.: US16884587Application Date: 2020-05-27
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Publication No.: US11587222B2Publication Date: 2023-02-21
- Inventor: Min Sik Chu , Seong Mi Park , Jiin Jeong , Jae Hoon Kim , Kyong Hee Joo , Ho Geun Park , Baek Young Lee
- Applicant: SAMSUNG SDS CO., LTD.
- Applicant Address: KR Seoul
- Assignee: SAMSUNG SDS CO., LTD.
- Current Assignee: SAMSUNG SDS CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: The PL Law Group, PLLC
- Priority: KR10-2019-0063195 20190529
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/00 ; G06N3/088 ; G06N3/04 ; G06K9/62

Abstract:
A method for clustering based on unsupervised learning according to an embodiment of the invention enables clustering for newly generated patterns and is robust against noise, and does not require tagging for training data. According to one or more embodiments of the invention, noise is accurately removed using three-dimensional stacked spatial auto-correlation, and multivariate spatial probability distribution values and polar coordinate system spatial probability distribution values are used as learning features for clustering model generation, making them robust to noise, rotation, and fine unusual shapes. In addition, clusters resulting from clustering are classified into multi-level clusters, and stochastic automatic evaluation of normal/defect clusters is possible only with measurement data without a label.
Public/Granted literature
- US20200380655A1 METHOD AND APPARATUS FOR DETECTING DEFECT PATTERN ON WAFER BASED ON UNSUPERVISED LEARNING Public/Granted day:2020-12-03
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