Invention Grant
- Patent Title: Inductor device
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Application No.: US16824753Application Date: 2020-03-20
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Publication No.: US11587710B2Publication Date: 2023-02-21
- Inventor: Hsiao-Tsung Yen , Ka-Un Chan
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corporation
- Current Assignee: Realtek Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW108145174 20191210
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/28 ; H01F27/29

Abstract:
An inductor device includes first, second, third and fourth wire, first and second connector, and eight-shaped inductor structure. First and second wires are disposed in first and second areas. Third wire is disposed in first area and partially overlapped with first wire in a vertical direction, and third wire is coupled to second wire. Fourth wire is disposed in second area and partially overlapped with second wire in the vertical direction, and fourth wire is coupled to first wire. First connector is partially overlapped with first wire or third wire in the vertical direction, and is coupled to inner wire and outer wire of third wire. Second connector is partially overlapped with second wire or fourth wire in the vertical direction, and is coupled to inner and outer wire of fourth wire. Eight-shaped inductor structure is disposed on outer side of third wire and fourth wire.
Public/Granted literature
- US20200312512A1 INDUCTOR DEVICE Public/Granted day:2020-10-01
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |