Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16881866Application Date: 2020-05-22
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Publication No.: US11587720B2Publication Date: 2023-02-21
- Inventor: Atsuo Hirukawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-097640 20190524
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F17/00

Abstract:
A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and first and second outer electrodes that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively extend along and cover at least parts of first and second end surfaces and parts of a first main surface. A stacking direction of the multilayer body and a coil axis direction of the coil are parallel to the first main surface. A low-dielectric-constant layer having a smaller relative dielectric constant than the insulating layers is provided between the multilayer body and the part of the first outer electrode that extends along the first main surface.
Public/Granted literature
- US20200373069A1 MULTILAYER COIL COMPONENT Public/Granted day:2020-11-26
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