Invention Grant
- Patent Title: Electronic component, circuit board, and method of mounting electronic component on circuit board
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Application No.: US17544992Application Date: 2021-12-08
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Publication No.: US11587731B2Publication Date: 2023-02-21
- Inventor: Eiji Teraoka , Hirokazu Takashima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2018-189163 20181004
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/228 ; H01G4/30 ; H01G4/012

Abstract:
An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.
Public/Granted literature
- US20220093334A1 ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON CIRCUIT BOARD Public/Granted day:2022-03-24
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