A chip-style conductive polymer capacitor and a method for packaging the same, wherein the capacitor includes a chip-style conductive polymer capacitor element, a substrate, and a packaging material layer; the chip-style conductive polymer capacitor element is provided on the substrate and includes an anode tantalum core, an anode terminal, an anode base electrode, a dielectric layer, a cathode layer, and a cathode base electrode; the anode tantalum core and the cathode layer are separated by the dielectric layer; the anode terminal is made of a tantalum metal chip or a tantalum-niobium alloy chip, and has a rectangle or rounded rectangle cross section. The packaging method herein enables a vacuum injection molding packaging structure or a spray coating packaging structure covering a full range of a packaging thickness from 0.3 to 10 mm, realizes arrayed packaging with high efficiency, and ensures the electrical performance and reliability of the product.