Invention Grant
- Patent Title: Backlight module
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Application No.: US17660417Application Date: 2022-04-24
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Publication No.: US11587745B1Publication Date: 2023-02-21
- Inventor: Fang-Yi Lien , Hsuan-Wei Ho , Tsung-Hsun Chen
- Applicant: Chicony Power Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Chicony Power Technology Co., Ltd.
- Current Assignee: Chicony Power Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Priority: TW111105631 20220216
- Main IPC: H01H13/83
- IPC: H01H13/83 ; F21V8/00

Abstract:
A backlight module includes a circuit board, a light-shielding plate, and a light guide plate. The circuit board is provided with first and second light-emitting units. The light-shielding plate is disposed above the circuit board. The light guide plate is disposed between the circuit board and the light-shielding plate and includes first and second single-key light guide areas. The first and second single-key light guide areas respectively have first and second through holes respectively accommodating the first and second light-emitting units. A distance between the geometric center of the first single-key light guide area and that of the light guide plate is greater than a distance between the geometric center of the second single-key light guide area and that of the light guide plate. A current flowing through the first light-emitting unit is greater than a current flowing through the second light-emitting unit.
Information query