Invention Grant
- Patent Title: Wafer supporting mechanism and method for wafer dicing
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Application No.: US17060003Application Date: 2020-09-30
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Publication No.: US11587809B2Publication Date: 2023-02-21
- Inventor: Bo Hua Chen , Yan Ting Shen , Fu Tang Chu , Wen-Pin Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L23/00 ; H01L21/78
Abstract:
A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.
Public/Granted literature
- US20220102176A1 WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING Public/Granted day:2022-03-31
Information query
IPC分类:
