Invention Grant
- Patent Title: Semiconductor module
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Application No.: US16934413Application Date: 2020-07-21
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Publication No.: US11587841B2Publication Date: 2023-02-21
- Inventor: Hiroyuki Masumoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2020-000963 20200107
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/13 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01L21/54 ; H01L23/04 ; H01L23/043 ; H01L23/10 ; H01L23/367 ; H01L23/053
Abstract:
A semiconductor module includes: a case; a semiconductor chip provided inside the case; a seal material injected to inside of the case and sealing the semiconductor chip; and a lid provided inside the case and contacting an upper surface of the seal material, wherein a tapered portion is provided at an end portion of the lid on an upper surface side, a gap is provided between a side surface of the end portion of the lid and an inner side surface of the case, and the seal material crawls up to the tapered portion through the gap.
Public/Granted literature
- US11538727B2 Semiconductor module Public/Granted day:2022-12-27
Information query
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