Invention Grant
- Patent Title: Transferrable pillar structure for fanout package or interconnect bridge
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Application No.: US17115882Application Date: 2020-12-09
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Publication No.: US11587896B2Publication Date: 2023-02-21
- Inventor: Joshua M. Rubin , Yang Liu , Steven Lorenz Wright , Paul S. Andry
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jeffrey M. Ingalls
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/538
Abstract:
A pillar structure is provided. The pillar structure includes a plurality of pillars. Each of the pillars include a capping material layer formed in a pit etched into a template wafer, a conductive plug formed on the capping material layer, a base layer formed on the conductive plug, and an attach material layer formed on the base layer. The pillars are joined vertically together to form the pillar structure.
Public/Granted literature
- US20220181286A1 TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT BRIDGE Public/Granted day:2022-06-09
Information query
IPC分类:
