Invention Grant
- Patent Title: LED chip and manufacturing method of the same
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Application No.: US16852522Application Date: 2020-04-19
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Publication No.: US11587914B2Publication Date: 2023-02-21
- Inventor: Jong Min Jang , Chang Yeon Kim , Myoung Hak Yang
- Applicant: SEOUL VIOSYS CO., LTD.
- Applicant Address: KR Ansan-si
- Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/62 ; H01L27/15 ; H01L23/31

Abstract:
A light emitting chip including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a passivation layer disposed on the third LED sub-unit, and a first connection electrode electrically connected to at least one of the first, second, and third LED sub-units, in which the first connection electrode and the third LED sub-unit form a first angle defined between an upper surface of the third LED sub-unit and an inner surface of the first connection electrode that is less than about 80°.
Information query
IPC分类: