Invention Grant
- Patent Title: Semiconductor structure
-
Application No.: US17214284Application Date: 2021-03-26
-
Publication No.: US11587926B2Publication Date: 2023-02-21
- Inventor: Jhon-Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L23/522 ; H01L29/78 ; H01L27/118

Abstract:
Semiconductor structures are provided. Each transistor includes a first source/drain region over a semiconductor fin, a second source/drain region over the semiconductor fin, a channel region in the semiconductor fin and between the first and second source/drain regions, and a metal gate electrode formed on the channel region and extending in a second direction. In a first transistor of the transistors, the first source/drain region is formed between the metal gate electrode of the first transistor and the metal gate electrode of a second transistor of the transistors. The second source/drain region is formed between the metal gate electrode of the first transistor and the dielectric-base dummy gate. A first contact of the first source/drain region is separated from a spacer of the metal gate electrode of the first transistor. A second contact of the second source/drain region is in contact with a spacer of the dielectric-base dummy gate.
Public/Granted literature
- US20210217751A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2021-07-15
Information query
IPC分类: