Invention Grant
- Patent Title: Semiconductor device with embedded storage structure and method for fabricating the same
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Application No.: US16839214Application Date: 2020-04-03
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Publication No.: US11587935B2Publication Date: 2023-02-21
- Inventor: Sheng-Hui Yang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/108 ; H01L29/66 ; H01L29/417

Abstract:
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a fin positioned on the substrate, a gate structure positioned on the fin, a pair of source/drain regions positioned on two sides of the fin, a dielectric layer positioned above the drain region and adjacent to the gate structure, and a storage conductive layer positioned on the dielectric layer. The drain region, the dielectric layer and the storage conductive layer form a storage structure.
Public/Granted literature
- US20210313331A1 SEMICONDUCTOR DEVICE WITH EMBEDDED STORAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-10-07
Information query
IPC分类: