- Patent Title: Array substrate, method for manufacturing same, and display device
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Application No.: US17461731Application Date: 2021-08-30
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Publication No.: US11587956B2Publication Date: 2023-02-21
- Inventor: Bo Wu , Yin Deng , Dongmei Wei , Hao Luo
- Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Sichuan; CN Beijing
- Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: IPro, PLLC
- Priority: CN202010925764.7 20200904
- Main IPC: G02F1/1343
- IPC: G02F1/1343 ; H01L27/12 ; G02F1/1362 ; G02F1/1368

Abstract:
An array substrate includes a gate layer, a first insulating layer, a channel layer, a source-drain layer, a second insulating layer, and a common electrode layer that are sequentially stacked, wherein the second insulating lay is provided with via holes formed therein; and the source-drain layer includes a plurality of sources, a plurality of drains, a plurality of data lines and a plurality of common electrode signal lines. The common electrode signal line includes a plurality of common electrode signal line segments, each of the common electrode signal line segments passes through at least one sub-pixel row, and each of the common electrode signal line segments is connected to the common electrode layer through the via hole.
Public/Granted literature
- US20220077196A1 ARRAY SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE Public/Granted day:2022-03-10
Information query
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