Invention Grant
- Patent Title: Epitaxial structure
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Application No.: US17689997Application Date: 2022-03-09
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Publication No.: US11588015B2Publication Date: 2023-02-21
- Inventor: Jia-Zhe Liu , Yen-Lun Huang , Ying-Ru Shih
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107126691 20180801
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/205 ; H01L33/22 ; H01L29/06 ; H01L21/02 ; C30B25/20

Abstract:
An epitaxial structure includes a substrate, a nucleation layer on the substrate, a buffer layer on the nucleation layer, and a nitride layer on the buffer layer. The nucleation layer consists of regions in a thickness direction, wherein a chemical composition of the regions is Al(1-x)InxN, where 0≤x≤1. A maximum value of the x value in the plurality of regions is the same, a minimum value of the x value in the plurality of regions is the same, and an absolute value of a gradient slope of each of the regions is 0.1%/nm to 50%/nm. A thickness of the nucleation layer is less than a thickness of the buffer layer. A roughness of a surface of the nucleation layer in contact with the buffer layer is greater than a roughness of a surface of the buffer layer in contact with the nitride layer.
Public/Granted literature
- US20220199763A1 EPITAXIAL STRUCTURE Public/Granted day:2022-06-23
Information query
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