Invention Grant
- Patent Title: Dual in-line memory module (DIMM) socket circuit to detect improper insertion of a DIMM edge into a DIMM socket
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Application No.: US17031800Application Date: 2020-09-24
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Publication No.: US11588279B2Publication Date: 2023-02-21
- Inventor: Xiang Li , George Vergis
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H01R13/66 ; H01R12/73 ; H01R13/635

Abstract:
An apparatus is described. The apparatus includes a dual-in line memory module (DIMM) socket having a first electrical circuit component embedded in a latch of the DIMM socket. The first electrical circuit component has a first exposed electrical contact that is to contact or not contact a second exposed electrical contact of a second electrical circuit component that is embedded in a housing of the socket depending on whether a corner of a DIMM is or is not properly inserted into the DIMM socket.
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