Invention Grant
- Patent Title: Imaging apparatus and imaging method, camera module, and electronic apparatus capable of detecting a failure in a structure in which substrates are stacked
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Application No.: US17129553Application Date: 2020-12-21
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Publication No.: US11588990B2Publication Date: 2023-02-21
- Inventor: Takumi Oka , Atsushi Suzuki , Naoki Kawazu
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JPJP2016-109196 20160531
- Main IPC: H04N5/369
- IPC: H04N5/369 ; H01L27/146 ; H04N5/367 ; H04N5/374 ; H04N5/378

Abstract:
The present disclosure relates to an imaging apparatus and an imaging method, a camera module, and an electronic apparatus that are capable of detecting a failure in an imaging device having a structure in which a plurality of substrates are stacked.
The timing at which a row drive unit provided in a second substrate outputs a control signal for controlling accumulation and reading of pixel signals in a pixel array provided in a first substrate is compared with the timing at which the control signal output from the row drive unit is detected after passing through the pixel array. Depending on whether or not the timings coincides with each other, a failure is detected. The present disclosure can be applied to an imaging apparatus mounted on a vehicle.
The timing at which a row drive unit provided in a second substrate outputs a control signal for controlling accumulation and reading of pixel signals in a pixel array provided in a first substrate is compared with the timing at which the control signal output from the row drive unit is detected after passing through the pixel array. Depending on whether or not the timings coincides with each other, a failure is detected. The present disclosure can be applied to an imaging apparatus mounted on a vehicle.
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