Invention Grant
- Patent Title: Wiring substrate
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Application No.: US17256036Application Date: 2019-06-28
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Publication No.: US11589457B2Publication Date: 2023-02-21
- Inventor: Seiichirou Itou
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2018-124602 20180629
- International Application: PCT/JP2019/025764 WO 20190628
- International Announcement: WO2020/004605 WO 20200102
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/10 ; H05K3/00 ; H05K3/38

Abstract:
A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.
Public/Granted literature
- US20210127486A1 WIRING BOARD Public/Granted day:2021-04-29
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