Invention Grant
- Patent Title: Circuit board and optical module
-
Application No.: US16626305Application Date: 2019-10-17
-
Publication No.: US11589458B2Publication Date: 2023-02-21
- Inventor: Xinnan Wang , Jianwei Mu , Shiming Wang , Ting Gao , Jiaao Zhang
- Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shandong
- Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
- Current Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shandong
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201811208050.3 20181017,CN201811403866.1 20181123
- International Application: PCT/CN2019/111714 WO 20191017
- International Announcement: WO2020/078432 WO 20200423
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18 ; H01S5/042 ; H01S5/40

Abstract:
An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.
Public/Granted literature
- US20210337662A1 CIRCUIT BOARD AND OPTICAL MODULE Public/Granted day:2021-10-28
Information query