Invention Grant
- Patent Title: Void free injection-molded cold plates
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Application No.: US16580605Application Date: 2019-09-24
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Publication No.: US11589477B2Publication Date: 2023-02-21
- Inventor: Harvey Lunsman , Tahir Cader
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Nolte Intellectual Property Law Group
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F3/02 ; F28F3/12 ; B29C45/26

Abstract:
Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.
Public/Granted literature
- US20210092869A1 VOID FREE INJECTION-MOLDED COLD PLATES Public/Granted day:2021-03-25
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