Invention Grant
- Patent Title: Nanometric copper formulations
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Application No.: US16202135Application Date: 2018-11-28
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Publication No.: US11590567B2Publication Date: 2023-02-28
- Inventor: Fernando De La Vega , Semyon Melamed
- Applicant: P.V. NANO CELL LTD.
- Applicant Address: IL Migdal Haemek
- Assignee: P.V. NANO CELL LTD.
- Current Assignee: P.V. NANO CELL LTD.
- Current Assignee Address: IL Migdal Haemek
- Agent Daniel Feigelson
- Priority: GB1403731 20140303
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C30B7/14 ; B22F1/0545 ; B22F9/24 ; C30B29/02 ; H05K1/09 ; B22F1/16

Abstract:
A formulation containing particulate matter including nanometric metallic copper particles, at least 10% of the particulate matter being single-crystal metallic copper particles, the particulate matter having an average secondary particle size (d50) within a range of 20 to 200 nanometers, the nanometric metallic copper particles being at least partially covered by at least one dispersant; a concentration ratio of crystalline cuprous oxide particles to the nanometric metallic copper particles, within the particulate matter, being at most 0.4; the formulation including a solvent, the particulate matter and the solvent forming a dispersion.
Public/Granted literature
- US20190291180A1 NANOMETRIC COPPER FORMULATIONS Public/Granted day:2019-09-26
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