Invention Grant
- Patent Title: Laser shock peening apparatuses and methods
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Application No.: US13744941Application Date: 2013-01-18
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Publication No.: US11590609B2Publication Date: 2023-02-28
- Inventor: Gary J. Cheng , Yiliang Liao , Yingling Yang , Chang Ye
- Applicant: Purdue Research Foundation
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Dentons Bingham Greenebaum LLP
- Agent Brian W. Chellgren; John V. Daniluck
- Main IPC: B23K26/356
- IPC: B23K26/356

Abstract:
Methods and apparatuses for processing materials to enhancing the material's surface strength, improving the material's cyclic and thermal stability of microstructures, and extend the material's fatigue performance. Embodiments include laser shock peening at material temperatures that are moderately elevated (from the material's perspective) above room temperature. Alternate embodiments include laser shock peening at very cold (cryogenic) material temperatures. Still further embodiments include laser shock peening while covering the surface of the material being processed with an active agent that interacts with the laser energy and enhances the pressure exerted on the surface.
Public/Granted literature
- US20130180969A1 LASER SHOCK PEENING APPARATUSES AND METHODS Public/Granted day:2013-07-18
Information query
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