Invention Grant
- Patent Title: Flux and solder paste
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Application No.: US17286431Application Date: 2019-10-21
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Publication No.: US11590614B2Publication Date: 2023-02-28
- Inventor: Ayaka Shirakawa , Hiroshi Sugii , Atsumi Takahashi , Daisuke Maruko , Hiroyoshi Kawasaki , Masato Shiratori
- Applicant: SENJU METAL INDUSTRY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JPJP2018-201032 20181025
- International Application: PCT/JP2019/041397 WO 20191021
- International Announcement: WO2020/085333 WO 20200430
- Main IPC: B23K35/362
- IPC: B23K35/362 ; B23K35/02 ; B23K35/36
Abstract:
A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.
Public/Granted literature
- US20210387292A1 FLUX AND SOLDER PASTE Public/Granted day:2021-12-16
Information query
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