Invention Grant
- Patent Title: Build layer coverage analysis
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Application No.: US16069509Application Date: 2016-03-10
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Publication No.: US11590709B2Publication Date: 2023-02-28
- Inventor: Xavier Vilajosana , Sebastia Cortes i Herms , David Ramirez Muela , Pablo Dominguez Pastor , Alejandro Manuel De Pena
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agent Michael Dryja
- International Application: PCT/US2016/021670 WO 20160310
- International Announcement: WO2017/155533 WO 20170914
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y30/00 ; B33Y50/02 ; B33Y10/00 ; B29C64/153 ; B29C64/20 ; B33Y50/00 ; B29C64/165 ; B29C64/188

Abstract:
Examples include apparatuses, processes, and methods for generating three-dimensional objects. An example apparatus comprises build material distributor and a controller. Examples distribute a particular build layer in a build area of the apparatus over a previous build layer. Examples determine a build layer temperature corresponding to the particular build layer. Examples analyze build layer coverage for the particular build layer based at least in part on a build layer temperature of the previous build layer and the build layer temperature of the particular build layer. Examples selectively recoat the particular build layer with additional build material based at least in part on the build layer coverage for the particular build layer.
Public/Granted literature
- US20190022950A1 BUILD LAYER COVERAGE ANALYSIS Public/Granted day:2019-01-24
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