Invention Grant
- Patent Title: Thermal transfer sheet
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Application No.: US16488642Application Date: 2018-02-28
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Publication No.: US11590786B2Publication Date: 2023-02-28
- Inventor: Junko Hirokawa , Tadahiro Ishida
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Burr Patent Law, PLLC
- Priority: JPJP2017-124668 20170626
- International Application: PCT/JP2018/007613 WO 20180228
- International Announcement: WO2019/003494 WO 20190103
- Main IPC: B41M5/42
- IPC: B41M5/42 ; B41M5/44

Abstract:
An object is to provide a thermal transfer sheet that can prevent the occurrence of layer detachment and has high transferability for preventing the occurrence of transfer defects such as delamination trace and tailing.
The thermal transfer sheet of the invention is characterized in that it includes a substrate, a release layer, and a transfer layer in that order, and the release layer contains at least one of alumina and alumina hydrate, and a binder resin.
The thermal transfer sheet of the invention is characterized in that it includes a substrate, a release layer, and a transfer layer in that order, and the release layer contains at least one of alumina and alumina hydrate, and a binder resin.
Public/Granted literature
- US20210138820A1 THERMAL TRANSFER SHEET Public/Granted day:2021-05-13
Information query
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