Invention Grant
- Patent Title: Layered food packaging system, temporary placement apparatus, and carrier device
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Application No.: US17328110Application Date: 2021-05-24
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Publication No.: US11591118B2Publication Date: 2023-02-28
- Inventor: Haruhiko Koike , Tomoya Hyodo , Koji Hara , Tomohiro Kamishio , Koichi Kirihara , Atsuo Ikeda
- Applicant: KABUSHIKI KAISHA YASKAWA DENKI
- Applicant Address: JP Fukuoka
- Assignee: KABUSHIKI KAISHA YASKAWA DENKI
- Current Assignee: KABUSHIKI KAISHA YASKAWA DENKI
- Current Assignee Address: JP Fukuoka
- Agency: Venjuris, P.C.
- Priority: JPJP2020-094214 20200529
- Main IPC: B65B5/04
- IPC: B65B5/04 ; B65B35/56 ; B65B35/16

Abstract:
A layered food packaging system includes: a carrier device configured to convey a sandwich in a horizontal posture in which a layering direction of the sandwich is substantially vertical; a temporary placement table configured to temporarily place the sandwich thereon in a vertical posture in which the layering direction of the sandwich is substantially horizontal; a first robot and a second robot configured to grip the sandwich that is conveyed by the carrier device, lift the sandwich from the carrier device, change the posture of the sandwich from the horizontal posture to the vertical posture, and temporarily place the sandwich on the temporary placement table; and a third robot configured to grip the sandwich that is temporarily placed on the temporary placement table, and insert the sandwich into a bag for packaging the layered food.
Public/Granted literature
- US20210371136A1 LAYERED FOOD PACKAGING SYSTEM, TEMPERARY PLACEMENT APPARATUS, AND CARRIER DEVICE Public/Granted day:2021-12-02
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