Invention Grant
- Patent Title: Method and apparatus for a transducer assembly with a standoff
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Application No.: US17063722Application Date: 2020-10-06
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Publication No.: US11591210B2Publication Date: 2023-02-28
- Inventor: Timothy Pachla
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Loppnow & Chapa
- Agent Matthew C. Loppnow
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81B3/00 ; H04R19/04 ; H04R31/00 ; H04R19/00
Abstract:
A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.
Public/Granted literature
- US20220106185A1 METHOD AND APPARATUS FOR A TRANSDUCER ASSEMBLY WITH A STANDOFF Public/Granted day:2022-04-07
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