Invention Grant
- Patent Title: Electrolytic copper foil having excellent handling characteristics in postprocessing, and manufacturing method therefor
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Application No.: US16959352Application Date: 2019-01-25
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Publication No.: US11591706B2Publication Date: 2023-02-28
- Inventor: Seung Min Kim , Shan Hua Jin
- Applicant: SK NEXILIS CO., LTD.
- Applicant Address: KR Jeongeup-si
- Assignee: SK NEXILIS CO., LTD.
- Current Assignee: SK NEXILIS CO., LTD.
- Current Assignee Address: KR Jeongeup-si
- Agency: K&L Gates LLP
- Priority: KR10-2018-0012179 20180131
- International Application: PCT/KR2019/001069 WO 20190125
- International Announcement: WO2019/151718 WO 20190808
- Main IPC: C25D7/06
- IPC: C25D7/06 ; C25D1/04 ; C25D3/38 ; H01M4/13 ; H01M4/66 ; H01M10/052

Abstract:
The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|Δ(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|ΔPD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
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